The SCHMIDT + HAENSCH iPR S inline process refractometer continuously measures refractive index and temperature in semiconductor wet chemical processes. Real-time data from the process liquid helps operators monitor chemical composition and identify deviations from defined operating conditions. For specific liquids, measurement values can be converted into concentration data using application-specific correlations. With an accuracy of ±0.0002 RI, the iPR S supports precise process monitoring. Sapphire and PFA wetted materials address demanding chemical compatibility requirements, while Flare and PrimeLock® connections facilitate integration into existing systems. From chemical blending and dosing to wafer cleaning, wet etching and chemical mechanical planarization (CMP), the iPR S provides continuous measurement information to support stable operating conditions and process control.
The iPR S is designed for integration into semiconductor wet chemical installations. Flare and PrimeLock® connections for tubing sizes from ¼” to 1″ provide flexibility when incorporating the refractometer into process systems. The combination of sapphire and PFA wetted materials supports applications where chemical compatibility and contamination risks require careful consideration. Once integrated into a suitable process line, the iPR S continuously measures refractive index and temperature directly in the liquid. Available output parameters include refractive index, temperature and concentration (wt%), with concentration determination based on an appropriate application-specific correlation. For convenient configuration and measurement monitoring, SCHMIDT + HAENSCH provides the UniConfig Windows PC software, which allows users to adjust instrument settings, view live measurement values and record data for further evaluation. Continuous measurement data provides additional information for process monitoring between laboratory measurements.
The iPR S is designed for semiconductor wet chemical processes where changes in liquid composition must be monitored. Potential applications include bulk chemical delivery, chemical blending and dosing, wafer cleaning, wet etching, post-etch residue removal and chemical mechanical planarization (CMP). In CMP slurry preparation and distribution, continuous refractive index and temperature measurements help identify composition changes associated with hydrogen peroxide (H₂O₂) dosing and dilution. Selective H₂O₂ concentration determination requires verification for the specific slurry formulation because other components also influence refractive index. In silicon wet etching, the iPR S can support KOH concentration monitoring. Changes caused by evaporation or dissolved silicon species can be monitored using a suitable process-specific correlation that accounts for their influence. For post-etch residue removal with EKC® chemicals, continuous measurements can help monitor variations in water content when a validated correlation is available for the specific cleaning formulation. These measurements support more consistent chemical conditions during wafer processing.
The iPR S measures refractive index and temperature continuously in semiconductor process liquids. Because refractive index depends on both chemical composition and temperature, the measured values provide information about changes in the process medium. With an application-specific correlation, refractive index and temperature can be used to determine concentration in weight percent (wt%) for defined liquid compositions. The refractometer covers a standard measuring range of 1.3200 to 1.5100 RI, with an accuracy of ±0.0002 RI. It operates at process temperatures from -20 to +90 °C and features a temperature sensor accuracy of ±0.1 °C. Sapphire and PFA wetted components, combined with a housing made from PVDF and PEEK, provide a material configuration designed with semiconductor wet chemical installations in mind. Flare and PrimeLock® connections support integration into different process-line configurations.
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