Wet etching process in wafer production

Control composition of wet etchants for wafer production

Wet chemical processes are used in many applications, including semiconductor and solar cell production. Monitoring using continuous real-time analysis during the wet chemical process is required to optimize process control as well as economic, environmental, and production results. SCHMIDT + HAENSCH inline process refractometers can achieve this process control. In microfabrication, etching is used to chemically remove layers from a wafer. Etching is an important process and every wafer is etched many times during the production process. Common wet etchants are nitric acid combined with either hydrofluoric acid or hydrochloric acid, sulfuric acid mixed with hydrogen peroxide and phosphoric acid. SCHMIDT + HAENSCH refractometers are the perfect tool to ensure the right composition of wet etchants and to avoid errors during wafer manufacturing. SCHMIDT + HAENSCH inline process refractometers (iPRs) provide inline, monitoring, and concentration control/dosage control directly in the process stream. Thanks to integrated digital switches, the iPRs can remotely control pumps and valves. SCHMIDT + HAENSCH refractometers are programmed to respond to signals, allowing a direct, real-time process control and simple automations (e.g. simple dosage systems) without the need for an additional power line control.

Optimizing semiconductor wet chemical processes

Many wet chemicals cannot be easily recycled, reused, or disposed of. An efficient use of the wet chemicals is desired for economic and environmental reasons. A minimum wastage of these wet chemicals while obtaining high quality production results can be achieved using SCHMIDT + HAENSCH inline process refractometers.

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iPR C2

Compact Inline Process Refractometer

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